• Two-part, white, thermally conductive silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A: Part B)


  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average Result
Thermal Conductivity 1.46 W/(mK)
Cure System Platinum
Tensile 260 psi (1.79 MPa)
Appearance White
Cure 30 minutes / 150 °C
Dielectric Strength 880 volts/mil (34.32 kV/mm)
Durometer 80 Type A
Elongation 20 %
Flow Rate 0.3 inches (7.62 mm)
Mix Ratio 15:1
Operating Temperature -65 °C / 240 °C
Specific Gravity 1.55
Work Time 3 hours
Comment Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)

Specialty Silicones for Displays

The NuSil® line of optoelectronic silicones enable device manufacturers from smart phones to stadium screens and everything in between to create next-generation displays that are sharper, brighter and more rugged.

Read more

Save to favorites

The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.