EPM1-2493

LOW VOLATILITY THERMALLY CONDUCTIVE SILICONE ELASTOMER

Description

  • Two-part, white, thermally conductive, low viscosity silicone elastomer
  • Cures with the addition of heat
  • 1:1 Mix Ratio (Part A: Part B)

Applications

  • For applications requiring a low volatility, conformal, thermally conductive silicone
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a limited flow material

Product Details

Property Average Result
Thermal Conductivity 0.95 W/(mK)
Viscosity 36,000 cP (36,000 mPa*s)
Cure System Platinum
Tensile 180 psi (1.24 MPa)
Appearance White
Cure 14 minutes / 150 °C
Dielectric Strength 465 volts/mil (18.14 kV/mm)
Durometer 65 Type A
Elongation 50 %
Ionic Content Cl <5 ppm
Ionic Content K <3 ppm
Ionic Content Na <5 ppm
Lap Shear 120 psi (0.83 MPa)
Mix Ratio 1:1
Specific Gravity 2.34
Tack Free Time 13 hours
Volatile Content 0.35 %
Volume Resistivity 34,000,000,000,000 ohmcm
Comment Recommended for bondlines 5 micron or greater.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.