EPM-2490

LOW VOLATILITY THERMALLY CONDUCTIVE SILICONE ADHESIVE

Description

  • Two-part, white, thermally conductive, electrically insulating, silicone system
  • Electrically insulative and non-corrosive
  • 15:1 Mix Ratio (Part A: Part B)

Applications

  • Flexible Thermal interface material (TIM) designed to provide heat transfer between electrical/electronic components and their heat sinks for a variety of component level packaging
  • For applications requiring a broad operating temperature range
  • Ideal where a form-in-place TIM is needed for use as a sealing, caulking, adhesive, or potting material in electronics applications requiring minimal volatility for prevention of contamination in sensitive devices

Product Details

Property Average Result
Thermal Conductivity 1.49 W/(mK)
Viscosity 3,672,800 cP (3,672,800 MPa*s)
Cure System Platinum
Tensile 200 psi (1.38 MPa)
Appearance White
Durometer 75 Type A
Elongation 30 %
Flow Rate 0.3 in (7.62 mm)
Ionic Content Cl <3 ppm
Ionic Content K <3 ppm
Ionic Content Na <6 ppm
Lap Shear 160 psi (1.1 MPa)
Mix Ratio 15:1
Specific Gravity 1.53
Tack Free Time 4.5 hours
Tear 50 ppi (8.82 kN/m)
Work Time 2 hours
Comment 1.5 W/mK, 160 psi lap shear primed w/CF1-135, 2 hr. pot life. (Contains Boron Nitride)

Contact NuSil™ to Order Now

For over 40 years, the NuSil brand has offered a wide range of high-purity silicones. Our team is ready to collaborate with you to provide silicone solutions to satisfy your unique requirements. For additional guidance during your selection process, or to order a sample, contact NuSil today.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.