Description
- Two-part, electrically conductive film adhesive
Applications
- For electronic and space applications requiring low outgassing and minimal volatile condensables to avoid condensation in sensitive devices
- Use for RFI and EMI shielding in electrical and space applications
- For bonding or sealing silicone elastomers and some metals or plastics
- For applications requiring shorter work times, easy clean-up, and consistent bond thickness
- For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Cure System | Platinum |
| Appearance | Black |
| Cure | 4 hours / 65 °C |
| Volume Resistivity | 150 ohmcm |
| Comment | Use for RFI and EMI shielding in electrical and space applications. For applications requiring shorter work times, easy clean-up, and consistent bond thickness. |
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.