Glennel Diamond Compound Paste, Electron Microscopy Sciences

Supplier: Electron Microscopy Sciences

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Supplier: Electron Microscopy Sciences

About this item

Glennel® UC Formulation is an oil soluble compound recommended for finishing wire dies, molds, cold heading dies, and general shop applications where diamond compounds are required.

Provides fast cutting action and superior finish
Meant to be used with Formula C extender for maximum efficiency

Glennel® UB Formulation is excellent for most applications where a diamond compound is desired. It is soluble in either water or oil and works with all common extenders. UB compound is recommended for polishing laboratory specimens and lapping of materials such as carbide, ceramic, sapphire, composites, ferrite, and silicon.

Glennel® OS Formulation is an oil soluble compound designed for lapping large areas of hard material. Use alone or with an extender it cleans up easily, provides aggressive stock removal and an outstanding finish.

All Diamond Pastes are available as a standard in 5 g size dispensing tube UB or UC and UBS or UCS.

Ordering information: 18 g sizes are available upon request.

Restricted Products: To process your orders without delay, please provide the required business documentation to purchase this product.

To order chemicals, medical devices, or other restricted products please provide ID that includes your business name & shipping address via email [email protected] or fax 484.881.5997 referencing your VWR account number. Acceptable forms of ID are:

• State issued document with your organization's Federal Tax ID Number
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• City or County issued Business License
• State Department of Health Services License
• Any other ID issued by the State that includes the business name & address

* ATTN: California Customers may require additional documentation as part of the CA Health & Safety Code. Products that fall under this regulation will be placed on a mandatory 21-day hold after documentation is received. Avantor will not lift restrictions for residential shipping addresses.