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BOND Dewax Solution, Leica Microsystem
BOND Dewax Solution, Leica Microsystem
Catalog # MSPP-AR9222
CAS Number:  
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BOND Dewax Solution, Leica Microsystem
Catalog # MSPP-AR9222
Supplier Number:  AR9222
CAS Number:  
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* ATTN: California Customers may require additional documentation as part of the CA Health & Safety Code. Products that fall under this regulation will be placed on a mandatory 21-day hold after documentation is received. Avantor will not lift restrictions for residential shipping addresses.

Specifications

  • Pack type:
    Bottle
  • Description:
    Bond Dewax Solution
  • Size:
    1 l
  • Environmentally Preferable:
  • Cat. No.:
    MSPP-AR9222
  • Supplier no.:
    AR9222

Specifications

About this item

BOND dewax solution is a deparaffinization solution specifically designed for use on the automated BOND system.

  • For in vitro diagnostic use

BOND dewax solution is much less harmful than alternative deparaffinization solutions such as xylene. It is provided ready-to-use in 1 l bottles and can be poured directly into the appropriate bulk reagent container on the instrument. The use of BOND dewax solution allows paraffin wax to be removed from tissue sections before rehydration and staining on BOND. It is specially formulated to be compatible with the automated BOND system, and efficiently removes wax from slides while retaining the integrity of tissue antigens and probe binding sites.

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