Labels for BBP33 Printers, Type B-729
Supplier: Brady
Certificates
About this item
Low-Profile polyimide (B-729) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.
- High-temperature, low-profile material is ideal for processes requiring thin or lightweight labels
- Ultra-durable matte white 1 mil polyimide material is thermal transfer printable
- Service temperature of –70 to 100 °C
- A ribbon is required to print this material
- Suitable for indoor use
- Rectangle with rounded corners
Heat resistant, abrasion-resistant, chemical-resistant, corrosion-resistant, humidity-resistant, UV-resistant, weather-resistant.
Used for circuit board labelling, component and equipment labelling.
Certifications: UL Approved; Meets requirements of MIL-STD-202G, Method 215K. Compliant with directive 2011/65/EU and 2015/863.
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