Copper ≥99.95% (metals basis), foil oxygen-free, annealed, Thickness: 0.25 mm (0.01 in)
Supplier: Thermo Fisher Scientific
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About this item
CAS Number:7440-50-8
:
Formula:Cu
MDL Number:MFCD00010965
:63.55 g/mol
Merck Index:13,02545
Boiling Pt:2595 °C (1013 hPa)
Melting Pt:1083 °C
Density:8,94 g/cm³ (20 °C)
Storage Temperature:Ambient
EINECS:231-159-6