Low-Profile polyimide (B-729) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.

• High-temperature, low-profile material is ideal for processes requiring thin or lightweight labels
• Ultra-durable matte white 1 mil polyimide material is thermal transfer printable
• Service temperature of –70 to 100 °C
• A ribbon is required to print this material
• Suitable for indoor use
• Rectangle with rounded corners

Heat resistant, abrasion-resistant, chemical-resistant, corrosion-resistant, humidity-resistant, UV-resistant, weather-resistant.

Used for circuit board labelling, component and equipment labelling.