Glennel Diamond Compound Paste, Electron Microscopy Sciences
Product Details & Documents
Glennel® UC Formulation is an oil soluble compound recommended for finishing wire dies, molds, cold heading dies, and general shop applications where diamond compounds are required.
- Provides fast cutting action and superior finish
- Meant to be used with Formula C extender for maximum efficiency
Glennel® UB Formulation is excellent for most applications where a diamond compound is desired. It is soluble in either water or oil and works with all common extenders. UB compound is recommended for polishing laboratory specimens and lapping of materials such as carbide, ceramic, sapphire, composites, ferrite, and silicon.
Glennel® OS Formulation is an oil soluble compound designed for lapping large areas of hard material. Use alone or with an extender it cleans up easily, provides aggressive stock removal and an outstanding finish.
All Diamond Pastes are available as a standard in 5 g size dispensing tube UB or UC and UBS or UCS.
Ordering information: 18 g sizes are available upon request.
Specifications
- Description:UC Oil Soluble
- Size:0.5 µm
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