Crystalbond™, Electron Microscopy Sciences
Product Details & Documents
Temporary adhesives that can be washed away after machining.
- Machining or slicing single crystal metal specimens
- Grinding and polishing sapphire, ceramic, optical garnets, ferrites, and LCD glass
- Dicing and slicing germanium and silicon wafers in semiconductor production
- Dicing and slicing alumina and beryllia substrates for IC and microelectronic production
- Holding beam leads in IC devices for pull-off tests
- Dicing subminiature chip capacitors and microwave IC substrates
These wash away temporary adhesives are used as a temporary bond for holding delicate crystals, metallurgical specimens, glass components, and ceramic substrates for dicing, slicing, drilling and polishing
Crystalbond™ 509:
Offers excellent adhesion to metals, glass, and ceramic. This material is the best for precise high purity work since it leaves no residue after dissolving and does not clog the diamond wheel as compared to conventional waxes. Each stick weighs about 90 grams.
Crystalbond™ 555:
The same as 509 but used in applications where it is desirable to have a temporary bond which is water soluble. Each stick weighs about 90 grams.
Crystalbond™ 590:
The same as 509 but offers maximum adhesion to subminiature parts. Each stick weighs about 225 grams.
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