Ideal for lead insertion packaging, providing ESD and physical protection to component leads.

• Foam is shuntable so board leads can be kept at equipotential, minimizing exposure to discharge
• Conductive crosslink polyethylene foam will not particulate, making it ideal for critical environments
• Non-sloughing, non-contaminating, and noncorrosive, this foam will not affect solderability

Resistivity range: <104 ohms/sq.
Density: 49.7 kg/m3 (3.1 lbs./cu.ft.)