Copper etchant 49-1 semiconductor grade
About this item
Copper Etchant 49-1 is a highly selective, moderate etch rate copper etchant. Will not attack photoresist or other metals, including nickel.
- MDL Number:MFCD00161912
- Boiling Pt:100 °C (water)
- Melting Pt:0 °C
- Density:1.01 g/cc
- Storage Temperature:Ambient
2 Options Available Below
- Item requires temperature control for storage and delivery with additional fees. It's not eligible for return due to safety and quality concerns. Consider requirements before purchasing.
- Return Policy
Product Details & Documents
Copper Etchant 49-1 is a highly selective, moderate etch rate copper etchant. Will not attack photoresist or other metals, including nickel.
- MDL Number:MFCD00161912
- Boiling Pt:100 °C (water)
- Melting Pt:0 °C
- Density:1.01 g/cc
- Storage Temperature:Ambient
Specifications for Product Family
Specification Test Results
- Appearance:Clear, colorless
- Etch Capacity (rate declines at ~70%):90-100 wafers/gallon
- Etch Rate at 25°C:40 Å/sec
- Filtration:1 um
- Incompatible Materials:III-V, Zn
- pH:5.9-6.3
- Recommended Operating Temperatures:20-80°C (30-40°C most common) °C
- Shelf Life:9 Months
- Storage Conditions:Ambient, refridgerated preferable
Product Family Options
Product Information
- Pack typeSizeAvailabilityPrice
- Supplier Number: 49-1-1QTItem requires temperature control for storage and delivery with additional fees. It's not eligible for return due to safety and quality concerns. Consider requirements before purchasing.
- HDPE bottleGallonEach (1US Gal)$95.13Case of 4 (1 US Gal)$380.52Supplier Number: 49-1-1GALItem requires temperature control for storage and delivery with additional fees. It's not eligible for return due to safety and quality concerns. Consider requirements before purchasing.
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