Hydrogen peroxide 30,00 - 32,00% LP
Product Details & Documents
Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.
- CAS Number:7722-84-1
- Formula:H₂O₂
- MDL Number:MFCD00011333
- Molecular Weight:34.01
- Boiling Pt:∼107 °C (1013 hPa)
- Melting Pt:< 0 °C
- Density:1.11 g/cm³ (20 °C)
- UN:2014
- ADR:5.1,II
- :Density: 1.11 g/cm³ (20 °C)
Documents
Specifications
Specification Test Results
- Assay (H2O2):30.00 - 32.00%
- Color:10
- Appearance:Conform
- Free Acid:0.500 µeq/g
- Total Organic Carbon:20,000 ppb
- Chloride:200 ppb
- Phosphate:1500 ppb
- Sulfate:3000 ppb
- Aluminum:30 ppb
- Antimony:5 ppb
- Arsenic:5 ppb
- Barium:10 ppb
- Beryllium:10 ppb
- Bismuth:10 ppb
- Boron:10 ppb
- Cadmium:10 ppb
- Calcium:80 ppb
- Chromium:15 ppb
- Cobalt:10 ppb
- Copper:20 ppb
- Gallium:20 ppb
- Germanium:20 ppb
- Gold:10 ppb
- Iron:30 ppb
- Lead:100 ppb
- Lithium:10 ppb
- Magnesium:30 ppb
- Manganese:10 ppb
- Molybdenum:10 ppb
- Nickel:10 ppb
- Niobium:10 ppb
- Potassium:400 ppb
- Silicon:100 ppb
- Silver:20 ppb
- Sodium:100 ppb
- Strontium:20 ppb
- Tantalum:15 ppb
- Thallium:20 ppb
- Tin:500 ppb
- Titanium:20 ppb
- Vanadium:10 ppb
- Zinc:25 ppb
- Zirconium:10 ppb
- 0.20µ Particle Count:1000 par/ml
- 0.50µ Particle Count:100 par/ml
- 1.00µ Particle Count:10 par/ml
Specifications
- Pack type:Poly bottle
- Size:1 gal.
Specifications
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