Used in applications masking PCB gold features for wave soldering and IR reflow ovens

• Removal leaves little or no residue
• Static charge generation during unwind and peel off stainless steel plate application is 5 volts @ 50% RH
• 1.0 mil thick (0.001" or 0.0254 mm) Polyimide Film (DuPont Kapton® or equivalent)
• 1.4 mil thick (0.0014" or 0.0356 mm) conductive polysiloxide adhesive
• Adhesive surface resistivity 10E3 to 10E4 ohms
• Max Temperature 260°C (500°F)
• For best results, apply to board using a rubber roller

Tapes should be stored in a dry, well ventilated room with a reasonably consistent temperature of 68°F (20°C) and be protected from exposure to direct sunlight.