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- Description:H22 Adhesive
- Size:1 oz
- Cat. No.:102091-814
- Supplier no.:12673-22
Epo-Tek® H22 is a two component, silver-filled epoxy system.
- Smooth, free-flowing, slightly thixotropic paste
- Excellent resistance to solvents, chemicals and moisture
- Extended pot life and fast curing at low temperature 100°C
- Designed for die bonding and sealing hybrid circuit
Adhesive's high Tg allows it to be used for high temperature applications. It contains no solvents; it is a NASA approved low outgasing epoxy. Recommended for SEM small angle cleavage and wafer bonding. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life is 16 hours and shelf life is 6 months at room temperature.