Crystalbond™, Electron Microscopy Sciences
About this item
Temporary adhesives that can be washed away after machining.
- Machining or slicing single crystal metal specimens
- Grinding and polishing sapphire, ceramic, optical garnets, ferrites, and LCD glass
- Dicing and slicing germanium and silicon wafers in semiconductor production
- Dicing and slicing alumina and beryllia substrates for IC and microelectronic production
- Holding beam leads in IC devices for pull-off tests
- Dicing subminiature chip capacitors and microwave IC substrates
These wash away temporary adhesives are used as a temporary bond for holding delicate crystals, metallurgical specimens, glass components, and ceramic substrates for dicing, slicing, drilling and polishing
Crystalbond™ 509:
Offers excellent adhesion to metals, glass, and ceramic. This material is the best for precise high purity work since it leaves no residue after dissolving and does not clog the diamond wheel as compared to conventional waxes. Each stick weighs about 90 grams.
Crystalbond™ 555:
The same as 509 but used in applications where it is desirable to have a temporary bond which is water soluble. Each stick weighs about 90 grams.
Crystalbond™ 590:
The same as 509 but offers maximum adhesion to subminiature parts. Each stick weighs about 225 grams.
7 Options Available Below
Product Details & Documents
Temporary adhesives that can be washed away after machining.
- Machining or slicing single crystal metal specimens
- Grinding and polishing sapphire, ceramic, optical garnets, ferrites, and LCD glass
- Dicing and slicing germanium and silicon wafers in semiconductor production
- Dicing and slicing alumina and beryllia substrates for IC and microelectronic production
- Holding beam leads in IC devices for pull-off tests
- Dicing subminiature chip capacitors and microwave IC substrates
These wash away temporary adhesives are used as a temporary bond for holding delicate crystals, metallurgical specimens, glass components, and ceramic substrates for dicing, slicing, drilling and polishing
Crystalbond™ 509:
Offers excellent adhesion to metals, glass, and ceramic. This material is the best for precise high purity work since it leaves no residue after dissolving and does not clog the diamond wheel as compared to conventional waxes. Each stick weighs about 90 grams.
Crystalbond™ 555:
The same as 509 but used in applications where it is desirable to have a temporary bond which is water soluble. Each stick weighs about 90 grams.
Crystalbond™ 590:
The same as 509 but offers maximum adhesion to subminiature parts. Each stick weighs about 225 grams.
Product Family Options
Product Information
- SizeAvailabilityPrice
- 100488-854Crystalbond 555Supplier Number: 50401-10
- 100497-420Crystalbond 590, 1 StickSupplier Number: 50402-01
- 100497-416Crystalbond 509, 1 StickCrystalbond 509, 1 Stick90 gDiscontinued-Supplier Number: 50400-01
- Discontinued-Supplier Number: -
- 101411-928Crystalbond 509, AmberSupplier Number: 50400-50
- Discontinued-Supplier Number: -
- 100501-262Crystalbond 590Supplier Number: 50402-02
- 100497-418Crystalbond 555, 1 StickSupplier Number: 50401-01
- 100490-016Crystalbond 509Supplier Number: 50400-05
- 100497-422Crystal Bond Stripper-590, 100gSupplier Number: 50402-S
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