You searched for: Copper
Copper ≥99.999% (trace metals basis), rods, Length random, Diameter 3.18 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), slug, Length 6.35 mm, Diameter 6.35 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.5% (trace metals basis), foil not certified pinhole-free, Thickness 0.01 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.95% (trace metals basis), foil not certified pinhole-free, Thickness 0.015 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.5% (trace metals basis), spherical powder -100 mesh
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9% (trace metals basis), spherical powder -170+270 mesh
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9% (trace metals basis), foil, annealed, Thickness 0.675 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), foil, Thickness 1.0 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), foil, Thickness 0.5 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), slug, Length 3.175 mm, Diameter 3.175 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), wire Ø 1.0 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), rods Ø 9.5 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99% (trace metals basis), turnings
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.99% (trace metals basis), foil, Thickness 1.0 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), wire Ø 0.25 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), wire Ø 2.0 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.995% (trace metals basis), slug, Length 6.35 mm, Diameter 6.35 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper, gauze woven from wire 40 mesh Ø 0.056 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Wire Cloth; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper, flakes -325 mesh
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid, average thickness 1-2 microns; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), foil, Thickness 0.025 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), wire Ø 0.127 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.99% (trace metals basis), shot oxygen-free, Diameter 13 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), foil, Thickness 0.1 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.99% (trace metals basis), slug, Length 6.35 mm, Diameter 6.35 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), foil, Thickness 0.1 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), powder -100 mesh
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9% (trace metals basis), spherical powder APS 10 µm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99% (trace metals basis), Powder -325 mesh
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III 8-11 micron APS Powder (FSSS); Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper, sputtering target sputter coater cathodes
Supplier: Electron Microscopy Sciences
EMS (ELECTRON MICROSCOPY SCIENCES) precious metal sputtering targets are made from high purity metals, starting 99.99% with most standard disc sizes, for use on most sputtering units from many manufacturers: Emitech, Emscope, Bio-Rad, Polaron, Edwards, Balzers, Plasma Sciences, Technics Hummers, Denton, Cressington, and much more.
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Copper, annular sputtering target, Diameter 57×40 mm (OD×ID)
Supplier: Electron Microscopy Sciences
Metal sputtering targets are made from high purity metals, starting 99.99% with most standard disc sizes, for use on most sputtering units from many manufacturers: Emitech, Emscope, Bio-Rad, Polaron, Edwards, Balzers, Plasma Sciences, Technics Hummers, Denton, Cressington, and much more.