You searched for: Copper
Copper ≥99.999% (metals basis), foil, Puratronic®, Thickness 2.0 mm (0.08 in)
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965
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Copper ≥99.9% (metals basis), spherical powder -100/+325 mesh
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965 Notes: Oxygen analysis included
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Copper ≥99.999% (metals basis), wire, Puratronic® oxygen-free, Diameter 0.5 mm (0.02 in)
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965
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Copper ≥99.9% (metals basis), tubing 3.175 mm (0.125 in) OD, 1.5 mm (0.059 in) ID
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965
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Copper ≥99.8% (metals basis), thin foil, Thickness 0.01 mm (0.0004 in)
Supplier: Thermo Scientific Chemicals
0.01mm (0.0003in) thick, 99.8% (metals basis).÷0.06g/25x25mm, not certified pinhole free,Not known to be hazardous in this form,25x25mm,50x50mm.
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Copper ≥99.995% (metals basis), sputtering target, Diameter 50.8 mm (2.0 in), Thickness 3.18 mm (0.125 in)
Supplier: Thermo Scientific Chemicals
Magnetron sputtering source
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Copper ≥99.999% (metals basis), rods, Puratronic®, Diameter 9.5 mm (0.4 in)
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965 Notes: 500g size consists of two pieces approximately 75cm & 5cm
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Copper ≥99.998% (metals basis), foil, Puratronic® oxygen-free, Thickness 0.5 mm (0.02 in)
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965
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Copper, gauze woven from wire 100 mesh, Diameter 0.11 mm (0.0045 in)
Supplier: Thermo Scientific Chemicals
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Copper ≥99.995% (metals basis), rods, Puratronic®, Diameter 25.4 mm (1.0 in)
Supplier: Thermo Scientific Chemicals
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Copper ≥99% (metals basis), powder -325 mesh, 10% max +325 mesh
Supplier: Thermo Scientific Chemicals
MDL: MFCD00010965
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Copper, gauze woven from wire 60 mesh, Diameter 0.19 mm (0.0075 in)
Supplier: Thermo Scientific Chemicals
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Copper ≥99.99% (metals basis), rods, Diameter 2.0 mm (0.08 in)
Supplier: Thermo Scientific Chemicals
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Copper ≥99.8% (metals basis), powder, atomized
Supplier: ALADDIN SCIENTIFIC
Copper ≥99.8% (metals basis), powder, atomized
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Copper ≥99.9999% (trace metals basis), wire Ø 1.0 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.5%, powder, atomized
Supplier: ALADDIN SCIENTIFIC
Copper ≥99.5%, powder, atomized
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Copper ≥99.9999% (trace metals basis), slug, Length 12.7 mm, Diameter 6.35 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9% (trace metals basis), shot 1-10 mm
Supplier: BeanTown Chemical
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Copper ≥99.999% (trace metals basis), wire Ø 0.64 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), foil, Thickness 0.05 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), foil, Thickness 2.0 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), rods, Length random, Diameter 3.18 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.995% (trace metals basis), foil, Thickness 0.5 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9999% (trace metals basis), slug, Length 6.35 mm, Diameter 6.35 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.8% (trace metals basis), foil, annealed, coated, Thickness 0.025 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.5% (trace metals basis), foil not certified pinhole-free, Thickness 0.01 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.9% (trace metals basis), flakes 1-5 µm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.995% (trace metals basis), wire Ø 0.25 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.999% (trace metals basis), foil, annealed, Thickness 0.127 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94
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Copper ≥99.995% (trace metals basis), foil, Thickness 0.25 mm
Supplier: BeanTown Chemical
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965; RTECS: GL5325000 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94