Buffer HF-Improved
Buffer used for pretreatment of planar silicon devices when plating with nickel plating solution products 44069 and 44070.
Density: 1.12
Appearance: Colorless
Odor: Acrid
Boiling Point: 103…105°
UN No.: 2817
Buffer used for pretreatment of planar silicon devices when plating with nickel plating solution products 44069 and 44070.
Density: 1.12
Appearance: Colorless
Odor: Acrid
Boiling Point: 103…105°
UN No.: 2817
Documents
- Catalog No:
- 44627.AK
- 44627.K2
- Odour/scent:
- Acrid
- Acrid
- MDL No.:
- MFCD00132734
- MFCD00132734
- Appearance:
- Colourless
- Colourless
- Density:
- 1.12 g/mL
- 1.12 g/mL
- UN No.:
- 2817
- 2817
Product Family Options
- DescriptionPk
Specifications
Cat. No.44627.AKOdour/scentAcridMDL No.MFCD00132734AppearanceColourlessDensity1.12 g/mLUN No.2817Specifications
Cat. No.44627.K2Odour/scentAcridMDL No.MFCD00132734AppearanceColourlessDensity1.12 g/mLUN No.2817
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