SCV1-2599

ULTRA LOW OUTGASSING THERMALLY CONDUCTIVE SILICONE

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • 15:1 Mix Ratio (Part A:B)

Applications

  • For applications requiring Ultra Low OutgassingTM and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non- flowable to limited flow material
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤0.1% and CVCM of ≤0.010%

Product Details

Property Average Result
Thermal Conductivity 1.6 W/(mK)
Viscosity 3,750,000 cP (3,750,000 mPa*s)
Cure System Platinum
Tensile 200 psi (1.38 MPa)
Appearance White
Cte
Cure 7 days / RTV
Dielectric Strength 540 volts/mil (21.06 kV/mm)
Durometer 75 Type A
Elongation 30 %
Lap Shear 150 psi (1.03 MPa)
Mix Ratio 15:1
Specific Gravity 1.53
Tear 50 ppi (8.82 kN/m)
Volume Resistivity 530,000,000,000,000 ohmcm
Work Time 2 hours
Comment Primed w/CF1-135, Contains Boron Nitride

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.