R-2939

LOW VISCOSITY, THERMALLY CONDUCTIVE SILICONE

Description

  • Two-part, white, thermally conductive, pourable silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A:Part B)

Applications

  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere openings in modules and housings where grooves or other configurations require a limited flow material with moderate thermal conductivity

Product Details

Property Average Result
Thermal Conductivity 0.75 W/(mK)
Viscosity 70,000 cP (70,000 mPa*s)
Cure System Platinum
Tensile 300 psi (2.07 MPa)
Appearance White
Cure 30 minutes / 150 °C
Dielectric Strength 810 volts/mil (31.59 kV/mm)
Durometer 70 Type A
Elongation 70 %
Mix Ratio 15:1
Specific Gravity 1.34
Tear 45 ppi (7.94 kN/m)
Work Time 4 hours
Comment 0.75 W/mK, 4 hr. pot life. (Contains Boron Nitride)

Specialty Silicones for Displays

The NuSil® line of optoelectronic silicones enable device manufacturers from smart phones to stadium screens and everything in between to create next-generation displays that are sharper, brighter and more rugged.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.