R-2939

LOW VISCOSITY, THERMALLY CONDUCTIVE SILICONE

Description

  • Two-part, white, thermally conductive, pourable silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A:Part B)

Applications

  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere openings in modules and housings where grooves or other configurations require a limited flow material with moderate thermal conductivity

Product Details

Property Average Result
Thermal Conductivity 0.75 W/(mK)
Viscosity 70,000 cP (70,000 MPa*s)
Cure System Platinum
Tensile 300 psi (2.07 MPa)
Appearance White
Cure 30 minutes / 150 °C
Dielectric Strength 810 volts/mil (31.59 kV/mm)
Durometer 70 Type A
Elongation 70 %
Mix Ratio 15:1
Specific Gravity 1.34
Tear 45 ppi (7.94 kN/m)
Work Time 4 hours
Comment 0.75 W/mK, 4 hr. pot life. (Contains Boron Nitride)

Contact NuSil™ to Order Now

For over 40 years, the NuSil brand has offered a wide range of high-purity silicones. Our team is ready to collaborate with you to provide silicone solutions to satisfy your unique requirements. For additional guidance during your selection process, or to order a sample, contact NuSil today.

Contact Us

Save to favorites

The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.