EPM-2495

LOW VOLATILITY THERMAL INTERFACE SILICONE ELASTOMER

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Designed to allow bond line thicknesses - 50 micron to reduce thermal resistance
  • 20:1 Mix Ratio (Part A: Part B)

Applications

  • For applications requiring low volatility under extreme operating conditions to avoid contamination in sensitive devices
  • To provide heat transfer between electrical/electronic components and their heat sinks while remaining electrically insulating
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average Result
Thermal Conductivity 0.64 W/(mK)
Extrusion Rate 140 g/minute
Cure System Platinum
Tensile 400 psi (2.76 MPa)
Appearance White
Cure 30 minutes / 150 °C
Durometer 55 Type A
Elongation 225 %
Ionic Content Cl <6 ppm
Ionic Content K <3 ppm
Ionic Content Na <3 ppm
Mix Ratio 20:1
Tear 55 ppi (9.7 kN/m)
Work Time 3 hours
Comment Recommended for bondlines 50 micron or greater. (Contains Boron Nitride)

Specialty Silicones for Displays

The NuSil® line of optoelectronic silicones enable device manufacturers from smart phones to stadium screens and everything in between to create next-generation displays that are sharper, brighter and more rugged.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.