Description
- Two-part, white, thermally conductive silicone gel
- Cures with the addition of heat
- 20:1 Mix Ratio (Part A:B)
Applications
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.95 W/(mK) |
| Extrusion Rate | 122 g/minute |
| Cure System | Platinum |
| Appearance | White |
| Cure | 72 hours / 25 °C |
| Durometer | 36 Type 00 |
| Lap Shear | 27 psi (0.19 MPa) |
| Specific Gravity | 1.3 |
| Tack Free Time | 16.5 hours |
| Volatile Content | 0.01 % |
| Work Time | 5.5 hours |
| Comment | Gel, soft and compliant |
Contact NuSil™ to Order Now
For over 40 years, the NuSil brand has offered a wide range of high-purity silicones. Our team is ready to collaborate with you to provide silicone solutions to satisfy your unique requirements. For additional guidance during your selection process, or to order a sample, contact NuSil today.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.