Description
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- Designed to allow bond line thicknesses ? 50 microns
- 20:1 Mix Ratio (Part A:Part B)
Applications
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.64 W/(mK) |
| Extrusion Rate | 140 g/minute |
| Cure System | Platinum |
| Tensile | 400 psi (2.76 MPa) |
| Appearance | White |
| Cure | 30 minutes / 150 °C |
| Durometer | 55 Type A |
| Elongation | 225 % |
| Mix Ratio | 20:1 |
| Tear | 55 ppi (9.7 kN/m) |
| Work Time | 3 hours |
| Comment | *22) 0.6 W/mK, Thin Bond Line |
Contact NuSil™ to Order Now
For over 40 years, the NuSil brand has offered a wide range of high-purity silicones. Our team is ready to collaborate with you to provide silicone solutions to satisfy your unique requirements. For additional guidance during your selection process, or to order a sample, contact NuSil today.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.