CV-2961

THERMALLY CONDUCTIVE, CONTROLLED VOLATILITY SILICONE

Description

  • Two-part, white, thermally conductive silicone
  • Cures with the addition of heat
  • Mix Ratio 10:1 (Part A:B)
  • Designed for enhanced performance in extreme low and high temperatures

Applications

  • For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
  • To provide moderate heat transfer between electrical/electronic components and their heat sinks
  • Use for adhering openings in modules and housings where grooves or other configurations require a limited flow material
  • For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average Result
Thermal Conductivity 0.79 W/(mK)
Viscosity 300,000 cP (300,000 mPa*s)
Cure System Platinum
Tensile 275 psi (1.9 MPa)
Appearance White
Cte
Cure 30 minutes / 150 °C
Durometer 75 Type A
Elongation 40 %
Lap Shear 205 psi (1.41 MPa)
Mix Ratio 10:1
Specific Gravity 1.38
Tack Free Time 3.5 hours
Tear 45 ppi (7.94 kN/m)
Work Time 2 hours
Comment *22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.