Description
- A two-part, thixotropic compound
- 15:1 Mix Ratio (Part A:B)
- Provides thermal conductivity when cured
- Cures at room or temperature or rapidly with heat
Applications
- Provides heat transfer between electrical/electronic components and heat sinks
- For use as a sealant, adhesive or molding material requiring solvent resistance
- Use to adhere covers on housings or where grooves or other configurations require a non-flowable material
- For applications requiring an operating temperature range of -65°C to 225°C (-85°F to 437°F)
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 1.25 W/(mK) |
| Cure System | Platinum |
| Tensile | 125 psi (0.86 MPa) |
| Appearance | White |
| Cure | 30 minutes / 150 °C |
| Durometer | 50 Type A |
| Elongation | 50 % |
| Mix Ratio | 15:1 |
| Specific Gravity | 1.53 |
| Work Time | 90 minutes |
| Comment | 50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride) |
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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.