Static dissipative polyimide (B-719) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.

• Surface resistivity values in the recommended range for dissipative ESD packaging materials as defined by ANSI/ESD S541-2008
• Service temperature of –70 to 100 °C

Low profile, high temperature, matte white polyimide material features a static dissipative adhesive and static dissipative release liner.