Amber high temperature polyimide with an ultra-durable adhesive withstands the extreme wash protocol and cleaning chemicals used in printed circuit board manufacturing.

• Resists high temperatures up to 300 °C
• Survives on the top or bottom side of printed circuit boards through the solder process
• Service temperature: –70 to 270 °C

Withstands multiple cycles of harsh condition washes for printed circuit boards and electronic component preprocess labelling.