Vacuum handling systems employ a precision pump to pick up small components for careful placement. Using hollow needle tips or rubber cups, the electric pens reduce the manual handling that could damage delicate chips and wafers. The compact vacuum handling systems are safe enough to work even in sensitive ESD environments. Generating a vacuum suction by a mere push of a button, the finger controlled devices have different lifting capacities and tip sizes.

Vacuum wand, C-series

Supplier: WINDRUSH TECHNOLOGY

This C series wand bodies are manufactured in ESD safe materials including PEEK tips are the safest means of wafer handling. The tips are optimally sized for each wafer diameter, ensuring that contact is both minimal and secure.

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Vacuum wand, F-series

Supplier: WINDRUSH TECHNOLOGY

This F series wand bodies are manufactured in teflon and are the cleanest means of wafer handling. Tips are available in PCTFE, PEEK, Vespel and stainless steel. The tips are optimally sized for each wafer diameter, ensuring that contact is both minimal and secure.