Silver plating solution ∼2,1 g/l metal content, electroless
About this item
Physical Form: Liquid Density: 1.04 Appearance: Colourless Melting Point: -5° Boiling Point: 103-105° UN No.: UN3287 MDL No.: MFCD00003397
Applications: For plating on copper, brass or copper alloys
- MDL Number:MFCD00003397
- Boiling Pt:103…105 °C
- Melting Pt:–5 °C
- Density:1.04
- Storage Temperature:Ambient
- UN:3287
- ADR:6.1,II
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Product Details & Documents
Physical Form: Liquid Density: 1.04 Appearance: Colourless Melting Point: -5° Boiling Point: 103-105° UN No.: UN3287 MDL No.: MFCD00003397
Applications: For plating on copper, brass or copper alloys
- MDL Number:MFCD00003397
- Boiling Pt:103…105 °C
- Melting Pt:–5 °C
- Density:1.04
- Storage Temperature:Ambient
- UN:3287
- ADR:6.1,II
Documents
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