Silicon dioxide ≥99.995% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 6.35 mm (0.250 in)
41097.KS
:
- Pk:1
- Seq:0001
:7631-86-9
:
:SiO₂
:MFCD00011232
:60.08 g/mol
:14,08493
:2230 °C (1013 hPa)
:1719 °C
:2.2 g/cm³ (20 °C)
:Ambient
:231-545-4
:14808-60-7