Copper ≥99.95% (metals basis), foil oxygen-free, annealed, Thickness: 0.25 mm (0.01 in)

Copper ≥99.95% (metals basis), foil oxygen-free, annealed, Thickness: 0.25 mm (0.01 in)

:7440-50-8

:Cu

:MFCD00010965

:63.55 g/mol

:13,02545

:2595 °C (1013 hPa)

:1083 °C

:8.94 g/cm³ (20 °C)

:Ambient

:231-159-6