This SmartStack® contactless horizontal wafer shippers safely protect and transport bumped wafers in full, thin or ultrathin thickness.

• Transports up to 25 wafers of varying thickness
• Stackable configuration increases shipping density and is automation compatible
• Used for thin, 3D, lensed or bumped wafers

Perimeter support ring minimizes the potential for surface area damage and eliminates the likelihood of scuffed, marred or bump damaged wafers. Rugged, engineering-grade polymer construction eliminates the need for TYVEK® separators and pink foam cushions.