Buffer HF-Improved
Buffer used for pretreatment of planar silicon devices when plating with nickel plating solution products 44069 and 44070.
Density: 1.12
Appearance: Colorless
Odor: Acrid
Boiling Point: 103…105°
UN No.: 2817
- MDL čí.:MFCD00132734
- Č. UN:2817
- Hustota:1.12 g/mL
- Zápach/vůně:Acrid
- Vzhled:Colourless
Frequently Bought Together