Bond Elut Diol (2OH), Agilent Technologies
Catalog #: CAAG12256007
Supplier: AGILENT TECHNOLOGIES, INC (CSD) CA
Specifications
- Capacity:6 ml
- Film thickness:40.00 µm
- Particle size:40 µm
- Temperature limit:Polar stationary phase
- Bed Weight:1 g
- Column Hardware:PP
- Phase:Diol (2OH)
Specifications
About this item
Bond Elut Diol forms strong hydrogen bonds and can also be used to retain nonpolar analytes.
- Provides polar and nonpolar modes
- Strong hydrogen bonding with analytes
- Similar capabilities to unbonded silica
Bond Elut Diol resembles unbonded silica, forming strong hydrogen bonds with analytes. Bond Elut Diol can also be used in nonpolar mode because the hydrocarbon spacer on its functional group provides enough nonpolar character for retention of hydrophobic analytes. Bond Elut Diol is a listed SPE device for the DIN 14333-1 method on benzimidazole fungicides.
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