Automated, FIMS compatible SB300 FOSB provides a clean, secure environment for valuable 300 mm wafers as they move through numerous handling and transport processes.

• Ultrapure polycarbonate housing is dimensionally stable resulting in lower particle generation and outgassing
• Molded-in wafer supports allow wafer location accuracy over multiple uses and minimize component interfaces, limiting particulation
• FIMS automation minimizes exposure to human contamination and ambient environments
• Protective gasket and filter; high filter flow rate allows external air to pass through as opposed to being forced through the gasket
• Ergonomic design allows multiple ergonomic orientations, optimizing operator handling

Applications:
Wafer handling and transport
Clean and secure wafer handling to minimize contamination
Reliable automation interface and interoperability

Materials:
Wafer contact:
Shell, door, door cushion - polycarbonate
Rear retainer: polybutylene terephthalate
Exterior:
Handles, auto flange, info pads - polycarbonate
Gasket: thermoplastic elastomer
KC plate: polycarbonate

Capacity: 25 wafers
Dimensions: 332.77×389.52×336.93 mm
Weight:7.8 kg
Wafer size: 300 mm
Pitch: 10 mm
Planes: ±0,5 mm